Aluminum-Copper¶

The Aluminum-Copper examples demonstrate the 2D solidification of a binary aluminium copper alloy. The T003_AlCu example corresponds to a directional solidification situation, whereas T002_AlCu_Equiaxed and A002_AlCu_Temp1d describe equiaxed solidification.

All three examples are concentration-coupled with Thermo-Calc™ coupling. T002_AlCu_Equiaxed and A002_AlCu_Temp1d provide an example of the use of the seed density nucleation model. Additionally A002_AlCu_Temp1d demonstrates the reading of data files for temperature-dependent mobilities and latent heat as well as the use of the far field approximation for temperature coupling and release of latent heat. Another feature of this example is the use of categorized seeds.

Alloy¶

Simulation conditions¶

Results¶

Concentration¶

T003_AlCu Cu concentration at $t = 2s$

T002_AlCu_Equiaxed Cu concentration at $t = 2s$

A002_AlCu_Temp1d Cu concentration at $t = 0.4 s$

Solidification¶

T003_AlCu solidification sequence

$-1$: interface, $0$: liquid, $1$: fcc_A1

$t = 0s$	$t = 0.1s$

$t = 0.5s$	$t = 1.0s$

$t = 1.5s$	$t = 2.0s$

T002_AlCu_Equiaxed solidification sequence

$-1$: interface, $0$: liquid, $1$: fcc_A1

$t = 0s$	$t = 0.1s$

$t = 0.5s$	$t = 1.0s$

$t = 1.5s$	$t = 2.0s$

A002_AlCu_Temp1d solidification sequence

$-1$: interface, $0$: liquid, $1$: fcc_A1, $2$: AlCu_THETA

$t = 0s$	$ t= 9.0000004E \cdot 10^{-2}s$

$t = 0.1s$	$t = 0.3s$

$t = 0.4s$	$t = 0.5s$

Files¶

• T003_AlCu
• T002_AlCu_Equiaxed
• A002_AlCu_Temp1d